Micross Advanced Interconnect Technology

Micross Advanced Interconnect Technology
Capabilities Statement:
Business Address:
3021 E. Cornwallis Rd., PO Box 110283
Raleigh Triangle Park
Primary Contact:
Mr. John Lannon
Primary Phone:
Long Business Description:

Micross Advanced Interconnect Technology (formerly RTI’s Microsystem Integration and Packaging group) is a leading provider of advanced packaging and 3D integration solutions for the defense, space, and medical market segments. From process development, proof of concept, prototyping, and low volume production, we offer access to novel microfabrication capabilities and advanced packaging technologies that enable higher performance systems with decreased size, weight, and power (SWaP). We are ITAR registered and have a state of the art, back end wafer processing facility staffed with full time engineers and researchers that allow us to consistently deliver solutions for our clients.

2nd Representative:
Mr. Alan Huffman